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Supply of germanium sheet, germanium single crystal, single crystal germanium sheet, germanium granule
Update Time : 2019-01-31 View : 12200
Shenzhen Pan American Strategic Metal Resources Co., Ltd. supplies Ge sheet, Ge single crystal, Ge sheet, Ge granule and imported pure Ge sheet for Ge wafer. Welcome customers to call, consult and negotiate business, 18928450898
Shenzhen Pan-American develops and supplies high-purity products with advanced quality in the world. It is in the leading position in China and is superior to other similar products in the world. It completely replaces imports. Pan-American Strategic Metals Company is committed to building an important supplier of high-tech cutting-edge materials in China. Pan-American strategy develops and operates metal products, metal compounds, high-purity metals, pays attention to cutting-edge technology and future science and technology, and welcomes customers at home and abroad to order and cooperate.
It can be customized according to customer's requirements. Semiconductor grade, solar grade and optical grade germanium sheets of various specifications and sizes can be processed.
In addition to the standard size of 2 "3" 4 "6", product size can also be customized according to customer requirements.
Size: 2 "3" 4 "6" or on customer's requirements
Crystalline orientation (100) (111) (110) or according to customer requirements.
Direction: (100) (111) (110) or on customer's requirements
Product type n-type/p-type/Undope
Type: n-type/p-type/Undope
Surface: grinding, single throwing and double throwing
Surface: lapping, single side polished, double side polished
Thickness: 150um~20mm
Thickness: 150um~20mm
Typical specifications are shown in the table below.
Semi-conducting Ge Specifications
Growth Method VGF
Dopant n-type: As; p-type: Ga
Wafer Shape Round (DIA: 2 "4" 6")
Surface Orientation ** (100)+0.5 degrees
** Other Orientations may be available upon request
Dopant As (n-type) Ga (p-type)
Resistivity (.cm) 0.05-0.25 0.005-0.04
Etch Pitch Density (cm2) < 300 < 300
Wafer Diameter (mm) 50.8 (+0.3) 100 (+0.3)
Thickness (m) 175 (+25) 175 (+25)
TTV [P/P] (m) < 15 < 15
WARP (m) <25 <25
IF*(mm) 17+1 32.5+1
OF(mm) 7+1 18+1
Polish** E/E, P/E, P/G E/E, P/E, P/G
Backside Ra (m)*** < 0.1 < 0.1
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